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LTC4244/LTC4244-1
42441f
Power MOSFET Selection Criteria
The LTC4244 uses external MOSFETs to limit the 5V and
3.3V supply currents. The following criteria should be
used when selecting these MOSFETs:
1. The on resistance should be low enough to prevent an
excessive voltage drop across the sense resistor and
the series MOSFET at rated load current given the
amount of gate to source voltage provided by the
LTC4244.
2. The drain-to-source breakdown voltage should be high
enough for the device to survive overvoltage transients
that may occur during fault conditions (the 5V and 3.3V
transient voltage limiters shown in Figure 1 will limit the
maximum drain-source voltage seen by these MOSFETs
during fault conditions).
3. The MOSFET package must be able to handle the
maximum, steady state power dissipation for the ON
state without exceeding the devices rated maximum
junction temperature. The MOSFETs steady-state, dis-
sipated power can be expressed as:
P
ON
 = I
MAX
2
 " R
DS(ON)
(8)
The increase in steady-state junction-to-ambient tem-
perature is given by:
T
J
  T
A
 = P
ON
 " R
窲A
(9)
4. The MOSFET package must be able to dissipate the heat
resulting from the power pulse during the transition
from off to on. A worst-case approximation for the
magnitude of the power pulse is:
P
V
I
I
OUT    INRUSH   LOAD
OFF-ON
<
+
(
)
n
"
2
(10)
where nV
OUT
 = 5V
OUT
 or 3.3V
OUT
, I
INRUSH
 is the tran-
sient current initially charging the load capacitance and
I
LOAD
 is the steady-state load current. The duration, t
ON
,
of the power pulse can be expressed as:
t
C
V
I
ON
LOAD    OUT
INRUSH
=
"
(11)
APPLICATIO S I FOR ATIO
U
U
U
5. The MOSFET package must be able to sustain the
maximum pulse power that occurs in the event the
LTC4244 attempts to power-up either the 5V or 3.3V
back-end supply into a short circuit (see Design Ex-
ample for a sample calculation).
Table 8 lists some power MOSFETs that can be used with
the LTC4244.
Input Overvoltage Transient Protection
Hot plugging a board into a backplane generates inrush
currents from the backplane power supplies due to the
charging of the plug-in board capacitance. To reduce this
transient current to a safe level, the CPCI Hot Swap
specification restricts the amount of unswitched capaci-
tance used on the input side of the plug-in board. Each
medium or long power pin connected to the CPCI female
connector on the plug-in board is required to have a 10nF
ceramic bypass capacitor to ground. Bulk capacitors are
only allowed on the switched output side of the LTC4244
(5V
OUT
, 3.3V
OUT
, 12V
OUT
, V
EEOUT
). Some bulk capaci-
tance is allowed on the 5V
IN
  and 3.3V
IN
  Early Power
planes, but only because a current limiting resistor is
assumed to decouple the connector pin from the bulk
capacitance. Circuits normally placed on the unswitched
side Early Power plane (PCI Bridge, for example) need to
to be decoupled by a current limiting resistor.
Disallowing bulk capacitors on the input power pins miti-
gates the inrush current during Hot Swap. However, it also
tends to create a resonant circuit formed by the inductance
of the backplane power supply trace in series with the
inductance of the connector pin and the parasitic capaci-
tance of the plug-in board (mainly due to the large power
FET). Upon board insertion, the ringing of this circuit can
exhibit a peak overshoot of 2.5 times the steady-state
voltage (>30V for 12V
IN
).
There are two methods for abating the effects of these high
voltage transients: using voltage limiters to clip the tran-
sient to a safe level and snubber networks. Snubber
networks are series RC networks whose time constants
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